The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. The components were experiencing failures following vibration and accelerated stress testing. Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing
